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La jeune pousse toulousaine a annoncé les nominations de Jiashu Chen en tant que vice-président d'ingénierie et de Kevin Taylor en tant que directeur financier, effectives dès le troisième trimestre 2007. Plus étoffée, la direction sera mieux à même d'assurer le lancement de nouveaux produits de liaison par fibre optique, précise-t-on dans un communiqué.

T2M-105-01-L-D-SM-DS-K-TR_Datasheet PDF

La jeune pousse toulousaine a annoncé les nominations de Jiashu Chen en tant que vice-président d'ingénierie et de Kevin Taylor en tant que directeur financier, effectives dès le troisième trimestre 2007. Plus étoffée, la direction sera mieux à même d'assurer le lancement de nouveaux produits de liaison par fibre optique, précise-t-on dans un communiqué.

Last month, LSI continued its cost-cutting efforts. It signed a definitive agreement to sell its semiconductor assembly and test operations in Pathumthani, Thailand to STATS ChipPAC Ltd. for $100 million.

LSI also announced that it will transition semiconductor and storage systems assembly and test operations performed at its facilities in Singapore and Wichita, Kansas to its current contract manufacturing partners. As part of those actions, LSI eliminated approximately 2,100 production positions worldwide.

T2M-105-01-L-D-SM-DS-K-TR_Datasheet PDF

Last month, LSI reported second-quarter 2007 revenues of $670 million, compared to $490 million in the second quarter of 2006 and $465 million in the first quarter of 2007. Second quarter 2007 GAAP net loss was $378 million, or minus 50 cents per diluted share, compared to second quarter 2006 GAAP net income of $54 million, or 13 cents per diluted share.

LONDON — The three-day International Electronics Forum, organized on an annual basis by Malcolm Penn and his Future Horizons analysis company (Sevenoaks, England), is heading out of Europe and into the Middle East in 2008. The event has been scheduled to take place May 7 to 9 at Madinat Jumeirah, Dubai, in the United Arab Emirates.

The Electronics Forum, heading into its seventeenth year, has always served as a meeting place for CEOs and other senior executives to pitch ideas to each other and build consensus. Traditionally the event has moved around Europe and comprised a day-and-a-half of forward-looking technical and market presentations

T2M-105-01-L-D-SM-DS-K-TR_Datasheet PDF

However, in 2008 the Forum is set to take place under the auspices of the Dubai Silicon Oasis Authority, a government-backed agency that is attempting to stimulate the development of an electronics design cluster in Dubai. The same format is being followed, starting with a Wednesday evening opening reception, although the speaker program has yet to be determined.

Madinat Jumeirah is a beach resort with two luxury hotels, a souk and the Madinat Conference center. It is located about 30 km from Dubai airport.

T2M-105-01-L-D-SM-DS-K-TR_Datasheet PDF

The Dubai Silicon Oasis is a technology campus and associated living accommodation being created at an estimated cost of $1.3 billion. The technology park is 7.2 million square meters aimed exclusively at the microelectronics industry and being developed largely on the premise of build it and they will come.” The first phase comprises a microelectronics innovation center (MIC), communal laboratory facilities, research and development centers, academic institutions, and residential areas.

The Emirate of Dubai has been attempting to move into electronics and information technology for some time. It was a backer of plans, together with the Brandenburg region of Germany, to build a silicon-germanium wafer fab in Frankfurt-an-der-Oder; the ill-fated Communicant Semiconductor Technologies AG.

We have, however, confirmed that Infineon Technologies is producing UMTS baseband chips for at least two cellphone companies, and Infineon is also the only non-captive source for WCDMA/UMTS transceiver chips — and also the biggest producer of GSM/GPRS transceivers, with a third of the world market last year — said Strauss.

Infineon (Munich, Germany) already supplies the EDGE baseband and associated RF transceiver for the existing 2G version of the iPhone that is being sold in the U.S through AT&T Wireless.

Strauss also suggests that there is significant Intellectual Property from InterDigital Communications in the 3G iPhone baseband chip likely to be manufactured by Infineon.

He notes that last week Interdigital, Inc. (IDCC) and its subsidiaries (including InterDigital Communications LLC) signed a worldwide, non-transferable, non-exclusive, fixed-fee royalty-bearing patent license agreement with Apple.

Under the seven-year license agreement, InterDigital granted a license to Apple under InterDigital's patent portfolio covering the current iPhone and certain future mobile phones, if any.”

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