San Jose, Calif. – Micrel Inc. rolled out its SuperSwitcher II family of integrated MOSFET buck regulators for high power density DC-DC applications .  

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San Jose, Calif. – Micrel Inc. rolled out its SuperSwitcher II family of integrated MOSFET buck regulators for high power density DC-DC applications .  

PTHF25-59_Datasheet PDF

San Jose, Calif. – Micrel Inc. rolled out its SuperSwitcher II family of integrated MOSFET buck regulators for high power density DC-DC applications .  

Qualcomm has created multiple proof-of-concept designs using SEF including some fabricated chips about which it would not share details. Ultimately, Qualcomm hopes all foundries, packaging houses and EDA vendors will support SEF.

The technique seems to be working fairly well,” said Nakamoto in an interview with EE Times at CICC. But right now a lot of calibration and verification cases need to be run to check that everyone on same page with these PDKs, models and tools,” he added.

PTHF25-59_Datasheet PDF

The Intersil Techwell Security Link over Coax (SLOC) devices are composed of the TW3801 camera modem PHY and the TW3811 receiver modem PHY . The SLOC devices are a new product family for Intersil, coming in the wake of the company’s springtime acquisition of Techwell , a fabless company mixed-signal video IC provider (including quad muxes, quad decoders and PCI/PCIe decoders).

The second product thrust is the Intersil MegaQ adaptive composite video equalizer , the ISL59601/2/3/4/5.

PTHF25-59_Datasheet PDF

SLOC modems The SLOC modem solution is designed to simultaneously transmit analog CVBS (Composite Video, Blanking, and Sync) video and digital IP video over a single coaxial cable. The benefit of the solution is to enable companies to install newer, megapixel ip cameras without having to replace or modify their existing coax infrastructure .

Key features of the TW3801 camera modem phy :

PTHF25-59_Datasheet PDF

Key features of the TW3811 receiver modem phy :

Availability : TW3801 and the TW3811 are available in engineering samples in the 100-TQFP (12x12mm) package. Mass production samples are slated for Q1 2011 .

KaiSemi's automated conversion and flow eliminates the need for customer involvement and resources, NRE costs, long lead times, and the risks that are part of traditional FPGA-to-ASIC conversion flows. KaiSemi manages the whole FPGA-to-ASIC process for the customer, from the purchase order through conversion, the ASIC flow, manufacturing, all the way through to the shipment of the ASIC chips. This seamless conversion process – combined with the Zero NRE model – lets the customer order an ASIC chip as if it were an off-the-shelf second-source replacement chip with a relatively short lead-time.

KaiSemi is set to exhibit in Electronica 2010 trade show in Munich, Germany, from November 9th to November 12th in Hall A5, booth #166.

For more information, visit the KaiSemi website (www.kaisemi.com) or email the head of sales and marketing Avi Pinkas ().

PARIS – IC physical design startup Atoptech Inc. said it has recruited EDA and semiconductor experts to establish a board of directors that will provide guidance as the company continues to develop its long-term technology and business roadmap.

Atoptech said the company's board gathers chairman Wu-Fu Chen, partner at Dragon Investments Fund; Jue-Hsien Chern, Ph.D., CEO of ATopTech; Jackson Hu, Ph.D., Chairman and CEO of NeoEnergy Microelectronics; Ping-San Tzeng, President and CTO of ATopTech; and Sang Wang, Ph.D., currently on the boards of Altos Design Automation, Anchor Semiconductor, and Silicon Frontline Technology.

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