Tkool Electronics

DPA is a serious threat to a wide range of fielded devices, from tactical military systems to emerging internet enabled devices. These new cores with DPA countermeasures, running on Microsemi FPGAs, provide maximum security while imposing the minimum technical burden on system developers,” said Rich Kapusta, vice president of terrestrial products for Microsemi's SoC Products Group (formerly Actel Corp.).

MTSW-132-24-F-T-225_Datasheet PDF

DPA is a serious threat to a wide range of fielded devices, from tactical military systems to emerging internet enabled devices. These new cores with DPA countermeasures, running on Microsemi FPGAs, provide maximum security while imposing the minimum technical burden on system developers,” said Rich Kapusta, vice president of terrestrial products for Microsemi's SoC Products Group (formerly Actel Corp.).

As of March 4, TEL said it would maintain the current production line at Tokyo Electron AT Limited’s Miyagi Plant (Matsushima-machi) and expand the production areas of the Yamanashi Plants (Nirasaki City).The development and office buildings are still scheduled to begin operation in April as initially planned.   ATE vendor Advantest Corp. of Japan issued the following statement: ''At this time we are still awaiting a full assessment of the earthquake's impact on Advantest and its facilities.  Initial information out of Japan reports no known injuries to Advantest staff, and little to no damage at our facilities. Clearly, this is a tragedy of epic proportion for Japan and its people, and our hearts and minds go out to all of those injured or suffering.  We thank you for your concern and will put out updates when available.''  

Map showing location of 300-mm fabs in vicinity of the quake, which was centered 80 miles off the coast near Sendai. The purple marker on the northwestern coast is a Renesas Electronics fab in Yamagata.The highest purple markers on the eastern coast are the location of Renesas' Naka fabs in Ibaraki and a facility operated by the Selete consortium. There are several other fabs in the region processing wafers at 200-mm and below, operated by the likes of Freescale, Texas Instruments, Toshiba and others. A larger map showing the location of 300-mm fabs in Japan and South Korea can be found here.  Source: SEMI, Google Maps.

MTSW-132-24-F-T-225_Datasheet PDF

— Dylan McGrath contributed to this story from San Francisco.

DeFacTo Technologies S.A. announced PLX Technology has licensed its DeFacTo Technologies’ HiDFT-SIGNOFF Design for Test (DFT) solution.

PLX Technology said its portfolio of high-end PCIe Switches, PCIe Bridges, NAS and DAS storage solutions, USB Controllers and other connectivity products will benefit from increased test coverage earlier in the design flow, without requiring additional engineering resources.

MTSW-132-24-F-T-225_Datasheet PDF

DeFacTo claimed its HiDFT-SIGNOFF solution allows scan logic insertion at RTL. HiDFT-SIGNOFF enables designers to create a high-level design for test signoff methodology, closing the gap between RTL and DFT. HiDFT-SIGNOFF allows early identification of test issues and enables new pre-synthesis design and DFT verifications.

HiDFT-SIGNOFF main features: . Enables testability signoff . Testability DRC . ATPG-aware Test Coverage Evaluation (TCE) . Accuracy of Test Coverage Evaluation (TCE) within 0.5% . AutoFix correction of scannability problems . Pinpoints testability weaknesses (controllability/observability issues) . Test point insertion for test coverage improvement . Hierarchical scan insertion methodology using test models (CTL) . Graphical interface to debug ATPG faults . Allows new DFT verifications at RTL: test vectors simulation, test power analysis, etc…

MTSW-132-24-F-T-225_Datasheet PDF

To access DeFacTo Technologies' HiDFT-SIGNOFF datasheet here .

SAN JOSE, Calif. – Infinera will present a paper at a top optical communications conference Thursday (March 10) describing a Terabit photonic integrated circuit transmitter. The Terabit PIC transmitter described at OFC/NFOEC integrates ten 112 Gigabits/second wavelengths.

Renesas advises on wafer fab, office shut downs 

Japan nuke plants still unstable

Quake prompts supply chain worries

Massive earthquake, tsunami hit northeast Japan

With the announcement of three additional low power processors targeting the embedded space, AMD has renewed its commitment to non-PC applications. The latest G-Series processors are aimed at 'headless' systems, where high-performance graphics are not required.

访客,请您发表评论:

Powered By Tkool Electronics

Copyright Your WebSite.sitemap