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DDR-266 will be very viable for a long time,” Gervasi said in his presentation before the JEDEX meeting in Santa Clara today. We are in the introduction stage for DDR-333,” he said in his speech before JEDEX, which is a two-day conference sponsored by the JEDEC group and other organizations.

MLG0603P68NJT000_Datasheet PDF

DDR-266 will be very viable for a long time,” Gervasi said in his presentation before the JEDEX meeting in Santa Clara today. We are in the introduction stage for DDR-333,” he said in his speech before JEDEX, which is a two-day conference sponsored by the JEDEC group and other organizations.

In 2002, The number of tool shipments are expected to drop by another 24% to 612 units, according to a forecast released earlier this year (see Jan. 29 story).

But some leading vendors believe that this forecast is too optimistic, saying that worldwide lithography-tool shipments could fall as low as 400 units in 2002.

MLG0603P68NJT000_Datasheet PDF

We're not looking for a good year,” lamented one vendor. The market for high-end 193-nm scanners looks promising in 2002, but the business for workhorse 248-nm tools remains soft, according to analysts.–M.L.

I n Taiwan, Macronix International Co. Ltd. this week said it has reduced the time it takes to make advanced flash memory products by 35% using single-wafer processing tools from Applied Materials Inc. . The chip maker recently completed development of its newest nonvolatile flash chips to use single-wafer processing systems as opposed to more traditional batch-lot production equipment.

MLG0603P68NJT000_Datasheet PDF

Applied Materials' Single Wafer Solution” is now being used by Macronix to fabricate the transistor structures in memory devices. These systems include rapid-thermal processing (RTP) chambers for thermal oxide formation. The systems employ Applied's In Situ Steam Generation” SiNgen chambers for chemical vapor deposition (CVD) oxide and nitride thin-films and the company's Polygen chambers for polysilicon films.

Single-wafer processing vs. batch steps enables fabs to more precisely control temperatures and other conditions on each substrate for higher yields. The argument against single-wafer processing has been cost and throughput. But Applied says its thermal systems can process wafers in minutes rather than hours for batch wafer lots, resulting in higher overall throughput in a factory.

MLG0603P68NJT000_Datasheet PDF

In addition to improving flexibility and turnaround time in production fabs, the single-wafer processing approach is speeding product development, said C. Y. Lu, chief technology officer at Macronix in Hsinchu.

To establish a niche in OEM rechargeable batteries, Rayovac Corp. is developing a rechargeable nickel-metal/hydride (NiMH) battery with an internal pressure control that prevents overcharging and allows the device to fully charge in 15 minutes or less.

WASHINGTON—As calls for beefed-up network security grow louder, industry groups are again promoting legislation that would amend a key law used to ferret closely held information from the government.

At issue in the post-9/11 debate about network security is whether to amend the Freedom of Information Act (FOIA) so that industry and government can share data on network vulnerabilities without exposing proprietary corporate data to disclosure.

According to sponsors of the Critical Infrastructure Information Security Act introduced in the Senate last September along with companion House legislation, the bill is intended to increase two-way information sharing on network vulnerabilities. Previously, companies have been reluctant to share threat data with government agencies for fear of disclosing proprietary data.

Hence, industry groups are backing the Senate legislation authored by Bob Bennett, R-Utah, because it would prevent the disclosure of shared data via the FOIA law by invoking existing non-disclosure exemptions. Those exemptions have been widely used by law enforcement and government agencies to protect sources and methods.

'No limitations'

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