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Wafer reclaimer issues further profits warning

MTSW-216-08-L-Q-225-RA_Datasheet PDF

Wafer reclaimer issues further profits warning

The switches in all three series can be DIN-rail or panel mounted. For ease of setup and maintenance, each Ethernet port is equipped with front-facing LED indicators.

The iCON-32005, iCON-32008, and iCON-32160 are available now. For more information, visit or contact sales representative at .

MTSW-216-08-L-Q-225-RA_Datasheet PDF

LONDON — A team of researchers at the University of Helsinki, Finland, has produced nano-sized metallic copper particles that, when suitably heat treated, can be made to form electricity conducting layers and patterns on paper.

The work by a group in the University's polymer chemistry department has great potential because polymer-protected metal particles can also be used in various electronics applications: for instance, the researchers suggest, different intelligent patterns can be printed on paper that, in the future, may replace components such as electronics boards.

The target of the team was to study and test the ability of polymeric and small-molecule compounds that contain amine groups to protect copper nanoparticles during manufacturing.

MTSW-216-08-L-Q-225-RA_Datasheet PDF

The particles were manufactured with either poly(ethylene imine) (PEI) or tetraethylenepentamine (TEPA) used as protecting compounds. The average size of the particles at room temperature was 8.5 nm (with PEI as the protecting agent) or 19.4 nm (with TEPA as the protecting agent).

Slightly oxidised at their surface, the particles were sintered to the paper surface, and the electrical conductivity of the layer formed was measured. Particles manufactured using PEI released the protective agent during sintering at relatively low temperatures (150–200 °C). At these temperatures, the size of the particles increased rapidly.

MTSW-216-08-L-Q-225-RA_Datasheet PDF

In a paper published by the American Chemical Society, the researchers suggest the electrical conductivity of the sintered particles was good enough to make them promising materials for use in electronics printed on paper.

Winchester, UK – 3M has entered into strategic agreement with Hong Kong-based Amperex Technologies Ltd. (ATL) that aims to expand the use of Nickel-Manganese-Cobalt (NMC) cathode materials in lithium ion batteries.

The NC Green Fund Program provided the impetus and focus for Nextreme in demonstrating the feasibility of improving our material's power conversion efficiency,” said Dr. Jesko von Windheim, CEO of Nextreme. The grant provided a much needed first step in proving the commercial viability of this technology.”

The concept of generating clean power from waste heat is alluring and gaining significant attention worldwide. However there is a direct link between thermoelectric module performance, in terms of efficiency, and the applicability of thermoelectrics in key power generation markets. The applications that stand out, both in terms of feasibility and market size, are micro power (e.g., powering remote sensors or other portable applications) and automobile waste heat energy conversion. While significant technical improvements in thermoelectric devices and systems are required before insertion in the automobile is feasible, remote power is immediately feasible with current technology. Furthermore the market for remote power is undeniably large. Sensors alone represent a TAM (total available market) of 8 billion units by 2012; while only a portion of this market will benefit from remote power, a reasonable estimate puts the ultimate potential at over 100M units per year for this application.

Nextreme plans to introduce new products based on the improved material performance in the future.

More information on converting waste heat into usable energy can be found here. Contact Nextreme at 3908 Patriot Dr., Suite 140, Durham, NC 27703-8031; call (919)-597-7300; e-mail; or visit their site.

About Nextreme Thermal Solutions(TM), Inc.Nextreme Thermal Solutions designs and manufactures microscale thermal and power management products for the electronics, telecommunications, semiconductor, consumer, and defense/aerospace industries. The company uses breakthrough thin-film thermoelectric material to embed cooling, temperature control and power generation capabilities into the widely accepted copper pillar bumping process used in high-volume electronic packaging. Nextreme's headquarters and manufacturing facility are based near Research Triangle Park, North Carolina.


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