Mobile applications constitute one of the key growth markets for memory, outpacing traditional compute platforms in the post-PC era. As performance and functionality demands increase, mobile applications impose ever more stringent requirements on memory technology. Users want their phones to do everything, weigh nothing, run for days on a single charge, and cost a pittance. Taken as a whole, it’s quite a task, and one that depends on the memory industry to deliver. Want to get a better understanding of device requirements, testing strategies, and new standards under development? Look no further than JEDEC’s Mobile Forum 2013 (May 1 and 2; Santa Clara, CA). The two-day meeting features a full slate of presenters, many of whom are involved in the standards committees.

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Mobile applications constitute one of the key growth markets for memory, outpacing traditional compute platforms in the post-PC era. As performance and functionality demands increase, mobile applications impose ever more stringent requirements on memory technology. Users want their phones to do everything, weigh nothing, run for days on a single charge, and cost a pittance. Taken as a whole, it’s quite a task, and one that depends on the memory industry to deliver. Want to get a better understanding of device requirements, testing strategies, and new standards under development? Look no further than JEDEC’s Mobile Forum 2013 (May 1 and 2; Santa Clara, CA). The two-day meeting features a full slate of presenters, many of whom are involved in the standards committees.

DSC6083ME2A-032K768T_Datasheet PDF

Mobile applications constitute one of the key growth markets for memory, outpacing traditional compute platforms in the post-PC era. As performance and functionality demands increase, mobile applications impose ever more stringent requirements on memory technology. Users want their phones to do everything, weigh nothing, run for days on a single charge, and cost a pittance. Taken as a whole, it’s quite a task, and one that depends on the memory industry to deliver. Want to get a better understanding of device requirements, testing strategies, and new standards under development? Look no further than JEDEC’s Mobile Forum 2013 (May 1 and 2; Santa Clara, CA). The two-day meeting features a full slate of presenters, many of whom are involved in the standards committees.

Other ESP families entering production this year include QuickDSP and QuickFC (Fiber Channel). In the next two to three years, ESP families will integrate 10 Gbits/s switching capability, and combination MIPS/DSP cores, the company said.

Meanwhile, QuickLogic has expanded its QuickPCI family. The QL5332 32-bit master/target controller is pin compatible with the QL5032, but adds support for the PCI host-bridge function, all PCI commands, master channel byte enable, target interface retry and disconnect, and data abort.

DSC6083ME2A-032K768T_Datasheet PDF

The QL5432 is pin compatible with the QL5332, but features more logic cells, deeper FIFOs, larger RAM space, and higher I/O counts. The device is the largest 32-bit/33MHz PCI ESP QuickLogic offers.

Prices start at less than $20 in quantities of 1,000. Reference development kits are priced at $1,495.

I think the practical end to in-house layout may be in sight. I say this for several reasons; complexity, learning curve, peak-load labor requirements and alternative use of manpower.

DSC6083ME2A-032K768T_Datasheet PDF

Let’s take a look at each issue and see what one might conclude. I think I have it right, but who knows, maybe I’m the only one that sees the murky end to internal layout teams at most organizations.

Complexity is a hackneyed word. It’s more often an excuse than a condition. But at 28-nm process technology, and of course beyond, it’s simply not your father’s physical design.

DSC6083ME2A-032K768T_Datasheet PDF

It used to be we would declare that the chip was done” when the netlist was verified. We all knew that layout was just an afterthought executed by some guy in the back room, the tech,” who in any other industry might wear a flannel shirt and carry a lunch pail.

Not today. A crack layout team is composed of approximately 12 to 24 very capable engineers, most with advanced degrees. Half of them will have specialized skills such signal integrity, high-speed I/O integration, DFT, package design (yes, this is now done up front and in complete coordination with the layout folks), A/MS expertise, SPICE modeling (always a help) and, of course, the power expert. To put it another way, the complexity of a 28-nm IC is stressing the very best of organizations. Just ask them.

Visitors at the shows will find some of the newest products from suppliers like 3M, Agilent Technologies, Amkor Technology, GenRad, SPEA,Fluke, Hewlett Packard, IFS, Keithley, Kulicke & Soffa, National Instruments, Nicolet, Northwest Analytical, Palomar Technologies and Teradyne.

The co-location of Wescon Spring and EtroniX will fill the need of the entire design team to meet in one place, said Donna Call, COO of Electronic Conventions Inc., which manages Wescon Spring.

The test and inspection portion of Nepcon West has evolved into a show and conference of its own. The new EvaluTech Exhibition and Conference will feature a full range of automated electronics test equipment, vision systems, software and evaluation tools, and the latest education for test engineers and other electronics manufacturing professionals. SPEA, a leading automatic test equipment vendor, will showcase its 4040 flying probe tester at EvaluTech. National Instruments will display its software and modular hardware. The PXI Systems Alliance will also be participating in EvaluTech 2001.

A full range of automated design tools, advanced software and the latest education will be on hand for design engineers and other electronics manufacturing professionals at the new Design Expo and Conference. MP International will bring packaging professionals and leading suppliers together at an all-new microelectronics packaging exhibition and conference, and showcase the advanced packaging technologies driving growth in the worldwide electronics industry.

The Nepcon Production & Support Exhibition and Conference will feature the latest electronics production equipment, and materials and services for electronics manufacturers, including adhesives, fiber optics, pc-board design tools, pc-board production equipment, pc-board materials software and supplies, rework and repair, soldering equipment and test equipment. Participants can attend sessions with such topics as lead-free solder technology; solder defects; prevention and rework for wave, reflow and cleaning; fine-pitch PCB design for manufacture and assembly; reliability of BGA, flip-chip and chip scale assemblies.

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