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Benefits Provided by the Call Center:

MTMM-142-02-T-D-000_Datasheet PDF

Benefits Provided by the Call Center:

Teig advocated the use of probabilistic tools and methodologies to better deal with process variations. He also called for more-automatic ways to optimize metrics. He discussed at some length the use of joint probability distribution” models for combinational optimization techniques.

If we can automate measurement design and pursue probabilistic design, we can build an infrastructure for 21st-century engineering,” Teig said, noting that the same infrastructure can ultimately support engineered biological systems and nanotechnology.

MTMM-142-02-T-D-000_Datasheet PDF

Arguing that floor planning can't be done effectively without placement, Teig called for floorplacers” that can manipulate various-size blocks and more than a million cells. He said clock, signal and power nets must all be routed together. Teig also called zero skew a completely artificial constraint” and said that intentional” skew, and slew, will help lower power requirements on chips.

One of Teig's more provocative questions was, Do we need clocks?” He advocated semi-synchronous or totally asynchronous designs, and suggested that chip designers can learn from biological systems.

IC routing, said Teig, must be gridless and not constrained by directional preferences. A developer of Simplex's X” architecture, Teig maintained it is obvious” that diagonal wires will improve quality.

MTMM-142-02-T-D-000_Datasheet PDF

Teig offered a more detailed overview of the X architecture in an invited paper at the System Level Interconnect Prediction Workshop, a relatively new conference that immediately preceded ISPD.

Kahng of UC San Diego outlined requirements for physical design from the recent International Technology Roadmap for Semiconductors. But he noted that physical design represents only about one-sixth of the EDA industry, and that there aren't enough R&D people to solve critical problems such as analog layout synthesis and reuse, deep-submicron fault models, global signaling and synchronization, and process variability.

MTMM-142-02-T-D-000_Datasheet PDF

Presentations from ISPD papers are due to be posted at the ISPD 2002 Web site within several weeks.

SAN MATEO, Calif. — TransEDA plc has released an option for its VN-Cover tool that allows it to perform code-coverage analysis during emulation.

It has been nearly 10 years since modern CMOS active-pixel image sensors first demonstrated their potential for high-quality image capture. Today, they are used in such high-volume applications as PC and Web cameras, toys and security cameras. They are also used in high-speed megapixel motion capture systems and in pill cameras” used in medical diagnostics. And they are expected to find use soon in mobile-phone cameras and many low-end digital still cameras.

The breadth of those applications reflects the technical strengths of the CMOS active-pixel image sensor technology.

CMOS image sensors are mixed-signal circuits containing pixels, analog signal processors, analog-to-digital converters, bias generators, timing generators, digital logic and memory.

The basic, three-transistor CMOS active pixel-the design used in most applications-contains a photodiode; a reset transistor, for resetting the photodiode voltage; and a source follower with select transistor, for buffering the photodiode voltage onto a vertical-column bus. Microlenses help funnel photons to the light-sensitive portion of the pixel, and color-filter arrays arranged in a red green blue mosaic pattern allow for color-information capture.

Additional analog-signal-processing circuitry located in the periphery of the array permits suppression of both temporal and fixed-pattern noise. While fixed-pattern noise was an issue with early CMOS active-pixel image sensors, recent sensors have no discernible fixed-pattern noise induced by circuitry and are instead limited by dark current in the pixels. Dark currents of less than 1,000 electrons/second per pixel at room temperature are routinely achieved.


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